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Wireless M2M and Mobile Broadband Devices

A report by Berg Insight
Paper Copy: $1,900
PDF (1-5 users): $2,900
PDF Corporate license: US$5,800
February 2007
120 pages

 Berg Insight expects that one in two cars and one in three notebooks PCs shipped worldwide in 2011 will have cellular communication capabilities. Moreover millions of utility meters, security alarms, POS-terminals and other devices are going to be connected to mobile networks. This will create a massive market for wireless M2M communication and mobile broadband data devices, exceeding 100 million units per annum. During 2007, Berg Insight estimates worldwide shipments in these categories to reach 23 million units. Learn more about the exciting developments on the worldwide market from this unique report in the M2M Research Series from Berg Insight.


This report will allow you to:

  • Understand the worldwide market for wireless M2M and mobile broadband devices.
  • Anticipate future trends and technology developments.
  • Evaluate the business opportunities in the main vertical market segments.
  • Identify potential customers, partners and competitors on a highly competitive global market.
  • Comprehend the differences and commonalities between Europe, North America and other regions.
  • Profit from valuable insights about the most successful business and technology propositions on the market.

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TABLE OF CONTENT

 1 Wireless M2M and mobile broadband data technology

1.1 Wireless and GPS chipsets
1.1.1 Wireless chipsets
1.1.2 GPS chipsets
1.2 Network communication technologies
1.2.1 Short and medium range wireless network technologies
1.2.2 Cellular mobile communication technologies
1.3 Wireless M2M data modules and terminals
1.3.1 M2M data modules
1.3.2 M2M terminals and devices
1.4 Mobile broadband modules and terminals
1.4.1 PC cards and ExpressCards
1.4.2 Embedded modules
1.4.3 Desktop modems and routers


2 Wireless chipset and GPS vendors

2.1 Wireless chipset vendor profiles
2.1.1 Agere Systems
2.1.2 Analog Devices
2.1.3 Freescale
2.1.4 Infineon
2.1.5 NXP Semiconductors
2.1.6 Qualcomm
2.1.7 Texas Instruments
2.2 GPS chipset and module vendor profiles
2.2.1 Fastrax
2.2.2 Global Locate
2.2.3 SiRF
2.2.4 Trimble
2.2.5 u-blox


3 M2M module and terminal vendors

3.1 Siemens Wireless Modules
3.2 Wavecom
3.3 Motorola
3.4 Enfora
3.5 Telit
3.6 Kyocera Wireless
3.7 Sagem
3.8 SIM Technology
3.9 Wireless M2M terminal vendors
3.9.1 Alpha Micro
3.9.2 Blue Tree Wireless Data
3.9.3 CalAmp
3.9.4 Dr. Neuhaus
3.9.5 Falcom
3.9.6 Owasys
3.9.7 Telesincro
3.9.8 Telular
3.9.9 BOX Telematics
3.9.10 CI Omnibridge
3.9.11 Cobra Automotive Technologies
3.9.12 DigiCore
3.9.13 MetaSystem
3.9.14 Trackm8
3.9.15 Trafficmaster
3.9.16 Viasat
3.9.17 WebTech Wireless


4 Mobile broadband vendors

4.1 Option
4.2 Novatel Wireless
4.3 Sierra Wireless
4.4 Ericsson
4.5 Huawei
4.6 Nokia
4.7 Wireless broadband gateway and modem vendors
4.7.1 4G Systems
4.7.2 AnyDATA
4.7.3 Digi International
4.7.4 Sarian Systems
4.7.5 Topex
4.7.6 Zadako


5 Hardware and wireless data communication integration

5.1 Vehicle telematics
5.1.1 OnStar
5.1.2 Crown Telecom 24Horas vehicle telematics service
5.1.3 The European eCall initiative
5.2 Utility metering and AMM
5.2.1 Drivers and barriers for AMM in Europe and North America
5.2.2 AMM infrastructure
5.2.3 AMM system integration
5.3 WWAN connectivity for mobile computing
5.3.1 Module integration process
5.3.2 Key notebook and embedded module vendors
5.3.3 Dell and Novatel Wireless


6 Market forecasts and trends

6.1 Wireless M2M market summary
6.2 Vehicle telematics
6.3 Utility meters
6.4 Retail and banking
6.5 Security systems
6.6 Other M2M applications
6.7 Embedded mobile broadband modules for notebooks and UMPCs

Glossary
____________________________________________________________________________________________

TABLE OF FIGURES

Figure 1.1: Examples of wireless module chipset vendors, by IC function
Figure 1.2: Selection of GPS chipset, module and board vendors
Figure 1.3: Examples of unlicensed radio bands worldwide
Figure 1.4: Wireless technology range versus throughput
Figure 1.5: Cellular wireless standards
Figure 1.6: Cost versus time diagram for wireless technology integration
Figure 1.7: Natural size wireless M2M modules
Figure 1.8: Examples of M2M terminal vendors
Figure 1.9: HSDPA PC card, PCI Express Mini Card and wireless desktop router
Figure 2.1: Key wireless chipset vendors
Figure 2.2: Examples of ADI’s wireless chipsets
Figure 2.3: Examples of Freescale wireless platforms
Figure 2.4: Examples of Infineon wireless ICs
Figure 2.5: Examples of NXP wireless ICs
Figure 2.6: Examples of Qualcomm wireless chipsets
Figure 2.7: Examples of Texas Instruments wireless chipsets
Figure 2.8: Fastrax iTrax MP OEM receiver modules
Figure 2.9: Global Locate integrated GPS ICs
Figure 2.10: SiRF chips for wireless applications
Figure 2.11: Examples of Trimble GPS modules and tracking devices
Figure 2.12: Low power, high sensitivity chip solutions from u-blox
Figure 3.1: Principal cellular M2M communication module vendors
Figure 3.2: Siemens range of wireless modules and terminals
Figure 3.3: Open AT Software environment
Figure 3.4: Wavecom range of wireless modules and terminals
Figure 3.5: Motorola’s range of wireless modules
Figure 3.6: Examples of Enfora’s range of wireless modules and terminals
Figure 3.7: Telit range of CDMA/GSM/GPRS modules
Figure 3.8: Sagem wireless M2M modules
Figure 3.9: SIM Technology’s wireless modules
Figure 3.10: CalAmp Skybility product overview
Figure 3.11: Falcom GSM/GPRS product overview
Figure 4.1: Wireless connectivity solution vendors for the mobile computing market
Figure 4.2: PC card and PCI Express Mini Card embedded module
Figure 4.3: Wireless connectivity device revenues (Worldwide 2006)
Figure 4.4: Examples of Option’s wireless connectivity products
Figure 4.5: Novatel Wireless’ range of wireless embedded modules and ExpressCards
Figure 4.6: Examples of Sierra Wireless embedded wireless modules and PC cards
Figure 4.7: Huawei’s range of wireless modules and data cards
Figure 5.1: Registered vehicles and annual sales, EU 23+2 and North America
Figure 5.2: Sales of OnStar equipped vehicles and OnStar subscribers
Figure 5.3: eCall establishment and lifecycle
Figure 5.4: Household power consumption and retail prices (Europe and North America)
Figure 5.5: Advanced metering penetration by state (USA 2006)
Figure 5.6: Mixed multipoint and point-to-point AMM infrastructure
Figure 5.7: Embedded module integration process
Figure 5.8: Major notebook and wireless module vendors
Figure 6.1 Worldwide wireless M2M module shipments forecast by application
Figure 6.2: Wireless M2M module shipments by region (2006–2011)
Figure 6.3: Shipments of vehicle telematics units (2006–2011)
Figure 6.4: Shipments of wireless M2M modules for utility metering (2006–2011)
Figure 6.5: Shipments of wireless M2M modules for retail and banking (2006–2011)
Figure 6.6: Shipments of wireless M2M modules for security systems (2006–2011)
Figure 6.7: Shipments of wireless M2M modules for other segments (2006–2011)
Figure 6.8: Shipments of embedded notebook broadband modules (2006–2011)
Figure 6.9: Worldwide notebook and UMPC shipments and WWAN module attach rate



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